ELECTRODES FOR SEMICONDUCTOR ELECTROPLATING APPARATUS AND THEIR APPLICATION

摘要

Wafer contact electrode assemblies (24) useful for supporting a wafer surface to be electroplated are disclosed herein. These fingers (235) provide electrical contact necessary for providing electric power between the wafer (55) and a corresponding anode in order to electroplate the surface wall of the wafer (55). Such conductive fingers (235) are useful in the production of electroplated products having reduced surface irregularities compared to products made by electroplating equipment and methods employing existing conductive fingers. In particular, the electrodes set forth herein are useful in electroplating apparatus and processes for the copper metallization of semiconductor wafers.