发明名称 |
Electronic module for simple circuits of electronic components |
摘要 |
An electronic module includes a housing (7) made of an insulating material and with a ground-face (8) with attached side walls (9), electronic components (1-3) arranged in recesses on the ground face (8) of the housing (7), and terminals (11) exiting from the housing. A cover (4), made of insulating material, closes the housing (7) with conductor paths (5) located on the cover (4), and through which the electronic components (1-3), and their connection to the terminals (11), are connected to form a circuit. The cover (4) and the conductor paths (5) are specifically manufactured in a two-component, injection moulding process, with the cover (4) formed by a thermoplast, and the conductor paths (5) by a conductive elastomer.
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申请公布号 |
DE19755155(A1) |
申请公布日期 |
1999.06.24 |
申请号 |
DE1997155155 |
申请日期 |
1997.12.11 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
JANSSEUNE, LUC, LEGUVIN, FR |
分类号 |
H01L23/13;H01L25/16;H05K1/00;H05K1/09;H05K3/32;(IPC1-7):H05K3/10;H05K5/02;H05K3/28;H01L23/057 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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