| 摘要 |
A process for manufacturing a printed circuit that replaces tin and/or tin-lead electroplating with tin-nickel based electroplating. The process includes printing a desired circuitry pattern onto a resist-coated copper-clad substrate. A tin-nickel material is electroplated onto the desired circuitry pattern, and the resist removed. The tin-nickel electroplating takes place within a bath comprised of a nickel source, a stannous source and a starter solution including a bifluoride salt, diethylenetriamine and triethylenetetramine.
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