发明名称 Supraleitervorrichtung mit einem Kontaktierdraht
摘要 The contact wire comprises a Pb alloy, with Pb as the main element, the other elements including at least one within the series comprising Cu, Ga, Ge, Se, Ag, In, Sn, Sb, Te, Au, Tl, Bi, Pd and Pt, for obtaining a thin wire via a liquid quenching process.Pref. the thin alloy wire is used between a superconductor chip and an external lead or between alpha superconductor chips, with a metallised surface on one side of the chip made of an alloy of the same materials as the wire.Pref. the superconductor chip has a laminated structure with a Si layer, a Nb layer and a metallised surface layer
申请公布号 DE3844879(C3) 申请公布日期 1999.06.24
申请号 DE19883844879 申请日期 1988.12.28
申请人 TANAKA DENSHI KOGYO K.K., TOKIO/TOKYO, JP 发明人 OGASHIWA, TOSHINORI, MITAKA, TOKIO/TOKYO, JP
分类号 H01L21/00;H01L39/02 主分类号 H01L21/00
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