PRETREATING FLUID AND METHOD OF PRETREATMENT FOR ELECTROLESS NICKEL PLATING

摘要

A method for preventing "bridging" between copper patterns in electroless nickel/gold plating. The method comprises immersing a substrate bearing copper patterns in a thiosulfate-containing pretreating fluid for electroless nickel plating or spraying the pretreating fluid over the substrate. The pretreating fluid may contain a pH regulator, complexing agent, surfactant, corrosion inhibitor, etc.