Method to check quality of wire bonds in integrated circuit production
摘要
At least one wire (4) is detected either by a camera and a defined line pattern, or by at least two cameras. The individual camera and the line pattern or both cameras are calibrated with respect to their spatial position. Arbitrary or predetermined points are identified and the location of these points are determined by triangulation in a computer system. An Independent claim is given for a device to carry out the method.
申请公布号
DE19754871(A1)
申请公布日期
1999.06.24
申请号
DE1997154871
申请日期
1997.12.10
申请人
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., 80636 MUENCHEN, DE
发明人
OBERDORFER, BERND, DIPL.-ING., 70771 LEINFELDEN-ECHTERDINGEN, DE