| 摘要 |
An ultra-fine gold alloy wire, for contacting semiconductor devices, consists of a gold alloy of composition (by wt.) 0.05-0.95% Pt (optionally partially or completely replaced by Pd), 0.001-0.1% cerium mischmetal (containing ≥ 50 wt.% Ce), 0-0.1% alkaline earth metal (preferably Be + Ca) and balance Au. Also claimed is production of the above wire by continuous casting, drawing to wire of usual diameter for bonding purposes and then annealing preferably at 300-700 degrees C. |
