发明名称 |
THERMOELECTRIC ELEMENT AND THERMOELECTRIC COOLING OR HEATING DEVICE PROVIDED WITH THE SAME |
摘要 |
<p>A thermoelectric element (1) comprises a partitioning plate (2) having electrical insulating properties; equal numbers of p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B) fixed to the partitioning plate (2) in a state in which they pass through the partitioning plate (2); flat copper electrodes (4) fixed to upper sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B); and T-shaped copper electrodes (5) fixed to lower sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B). Lower portions protruding from the lower surface of the partitioning plate (2) are accommodated within a cooling vessel and are cooled directly by a coolant or air. <IMAGE></p> |
申请公布号 |
EP0924481(A1) |
申请公布日期 |
1999.06.23 |
申请号 |
EP19980929804 |
申请日期 |
1998.07.02 |
申请人 |
SEL.APPLICATION CO., LTD.;MORIX CO., LTD. |
发明人 |
YAMADA, KAZUKIYO;MORINO, ISAO |
分类号 |
F25B21/02;H01L35/30;H01L35/32;(IPC1-7):F25B21/02;H01L23/38 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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