| 摘要 |
A method of manufacturing and testing integrated optical composites in which fiber pigtails are aligned with and attached to the optical output ports of a plurality of integrated optical components on a wafer, prior to separation into individual components. The multiple pigtails are arranged at the ends opposite the wafer, to facilitate optical connections during active alignment and measurement testing. The integrated optics wafer (3a), (3b) and (3c), with waveguide paths (35-35n) has been prepared for fiber pigtail attachment, by the formation of fiber attachment supports (32/33) and the exposing of output ports (36) and (36a) by the formation of transverse exit groove (31). Although in a typical device, some of the ports are outputs ports (e.g., on one side) and other ports are input ports (e.g., on the other side) for the sake of simplicity, optical output ports as used herein may also include optical input ports. The wafer has been partially pre-diced to form inter-component gaps (40), but the component remain connected by cross-connect segments (37) and (38) and (37a) and (38a). Pre-dicing may be carried out using conventional vibrating wire cutting, by stopping the operation before the dicing wire passes completely through the wafer. Other dicing means such as a multi-wire (vibrating) cutter or a multi-blade saw may also be used. <IMAGE> |
