Method of encapsulating a wire bonded die

摘要

A method of encapsulating a wire bonded die mounted on a carrier substrate, said carrier substrate and wire bonded die having a dam extending about said wire bonded die, comprising the steps of dispensing liquid encapsulant material in a predetermined pattern within an area bounded by said dam, said dam pattern including a plurality of discrete, single-point dispensing locations and allowing said liquid encapsulant material to spread out and form an encapsulating layer over said wire bonded die.