| 摘要 |
<p>An image sensor chip for use in configuring a contact-type image sensor, wherein the fabrication of a substrate on which this chip is mounted can be markedly simplified, and the pickup of noise by the analog output can be reduced. The chip is fabricated by integrating a prescribed number of photoelectric conversion elements (28) as photoreceptors, analog switches (29) connected in series to the corresponding photoelectric conversion elements (28), a switch circuit (30) for sequentially switching on the analog switches (29) in accordance with clock signals, output loads (31, 40) jointly connected in series to sets composed of the photoelectric conversion elements (28) and their respective analog switches (29), an amplification circuit (32) for amplifying the potential of the output load components on the side of the photoelectric conversion elements, and, preferably, a gain-adjusting resistor R for this operational amplifier (32). In this case, the gain-adjusting resistor (R) comprises a plurality of resistors (Ra1, Ra2, Ra3, Ra4, Rb1, Rb2, Rb3, Rb4) and Rb4 connected in series and cuttable bypass wirings (50) provided to all or some of the plurality of resistors. <IMAGE></p> |
