| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a carrying container for wafer at low cost, while a lightening of the carrying container is contrived by a method, wherein at least upper and lower plate parts and side plate part of a container main body are formed of a metallic plate material of uniform thickness to constitute the container main body into a box having an open part. SOLUTION: An FOUP 1 is provided with a container main body 2 for housing a plurality of semiconductor wafers in tiers and an opening and shutting cover 4 to be an openable part 3 formed in the main body for sealing. The main body 2 is constituted into a box, which blocks respectively a side plate pad 5 formed into a U-shape and the upper and lower parts of the side plate part 5, and the plate part 5 and the upper and lower parts of the plate part 5 are integrally formed by pressing a metallic plate material 8 consisting of aluminium or an aluminium alloy. Moreover, the main body 2 is molded with a curved surface form so as to projection to the outside of the main body 2 at press molding of the metallic plate material 8 on the side plate part of the main body 2 and upper and lower plate parts 6 and 7. It is preferable that this curved surface form be specially formed on parts P, at which the fellow plate parts 5 and 7 are continued, and in this way, the strength of the main body 2 is reinforced.</p> |
