发明名称 |
POSITIVE PHOTORESIST COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a positive photoresist composition having solved problems on troubles during the elapse of time after exposure until heat treatment and enhanced in sensitivity and resolution and capable of obtaining a superior resist pattern free of cracking of the resist pattern. SOLUTION: This composition comprises a resin having groups increasing solubility in an alkaline developing solution by decomposition due to action of an acid and a mixture of a photo-acid-generator (B-1) high in effect of lowering dissolution speed in an alkaline developing solution and a photo-acid- generator (B-2) small in effect of lowering the dissolution speed of an exposed part as compared with (B-1). |
申请公布号 |
JPH11167199(A) |
申请公布日期 |
1999.06.22 |
申请号 |
JP19970333145 |
申请日期 |
1997.12.03 |
申请人 |
FUJI PHOTO FILM CO LTD |
发明人 |
UENISHI KAZUYA;KODAMA KUNIHIKO;AOSO TOSHIAKI;SATO KENICHIRO |
分类号 |
G03F7/004;G03F7/00;G03F7/039;H01L21/027;(IPC1-7):G03F7/004 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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