发明名称 POSITIVE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a positive photoresist composition having solved problems on troubles during the elapse of time after exposure until heat treatment and enhanced in sensitivity and resolution and capable of obtaining a superior resist pattern free of cracking of the resist pattern. SOLUTION: This composition comprises a resin having groups increasing solubility in an alkaline developing solution by decomposition due to action of an acid and a mixture of a photo-acid-generator (B-1) high in effect of lowering dissolution speed in an alkaline developing solution and a photo-acid- generator (B-2) small in effect of lowering the dissolution speed of an exposed part as compared with (B-1).
申请公布号 JPH11167199(A) 申请公布日期 1999.06.22
申请号 JP19970333145 申请日期 1997.12.03
申请人 FUJI PHOTO FILM CO LTD 发明人 UENISHI KAZUYA;KODAMA KUNIHIKO;AOSO TOSHIAKI;SATO KENICHIRO
分类号 G03F7/004;G03F7/00;G03F7/039;H01L21/027;(IPC1-7):G03F7/004 主分类号 G03F7/004
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