| 摘要 |
PROBLEM TO BE SOLVED: To obtain a BGA and an OMPAC(overmolded pad array carrier) element, which are capable of transmitting and receiving a light signal by a method, wherein an optically active part of a semiconductor component is coated with a light-transmitting material. SOLUTION: A semiconductor element 10 consists of a substrate 11, conductive traces 12 and solder pads 13 which are arranged on the bottom of the substrate, and conductive traces 14 and chip or die mounting pads 17 which are arranged on the upper surface of the substrate 11. The exposed parts of the traces 14 and the pads 17 are covered with a solder mask material layer 22. The layer 22 covers the end parts of conductive vias 19 on the upper surface of the substrate 11. A semiconductor chip 24 has chip bonding pads 26, and these pads are coupled with the traces 14 corresponding to the pads 26 through interconnecting wires 27. The chip 24, the wires 27 and one part of the layer 22 are covered with a light-transmitting material 29, and this material 29 made to harden. |
