| 摘要 |
<p>PROBLEM TO BE SOLVED: To protect wafers and accurately align the wafers by gripping the wafers floating on an extra-pure water film, to align them. SOLUTION: A semiconductor wafer aligning system is provided with a table with a spray pipe 12 formed to spary extra-pure water 10 supplied from an extra-pure water supply source, upward, and guide pieces 18 installed on the table so as to laterally grip a wafer 16 floating on a water film formed by the spray pressure of the extra-pure water 10 and to guide it into a correct position. A wafer aligning method using the semiconductor wafer aligning system is provided with a stage of spraying the extra-pure water 10 to the wafer 16 upon the soft placement of the wafer 16, gripping the wafer 16 by the guide pieces 18 to align the wafer 16 and then transferring the wafer 16 to another equipment.</p> |
