| 摘要 |
<p>PROBLEM TO BE SOLVED: To shorten the distance between a part junctioning part and a wire bonding part with bonding junction property which is kept properly and the compact configuration of an overall device is achieved. SOLUTION: On an alumina substrate 1, a conductor 3 comprising, e.g., Cu conductor material is formed in the specified pattern. A large number of lands 3a, 3b and 3c for mounting parts are formed on the conductor 3. On the land 3c, an electronic component (a part other than a flip chip) 6 such as, e.g. a chip capacitor is bonded by conducting adhesive 5 having electrical conductivity and superior thermal conductivity. On the land 3b, a flip chip 8 is bonded by solder 7. The land 3c and a power element P are connected electrically by an aluminum wire 9. In this case, the amount of flux, which becomes the case of the contamination of the bonding land 3c is decreased, and troubles such as the deterioration of the bonding junction property can be suppressed. Furthermore, the cleaning work of the solder flux can be reduced by the adhesive junction of the electronic component 6.</p> |
