SEMICONDUCTOR MANUFACTURE DEVICE AND PROCESSING METHOD FOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor manufacture device which is capable of baking a wafer uniformly. SOLUTION: A hot plate unit 1 is provided with a cover 2. The cover is provided with an inner wall face 2c and a vacuum port 6. A plate 4 having an open pore 4a is provided immediately below the vacuum port 6. An interval between the plate 4 and a main face 7a is equal to an interval between the main face 7a and the inner wall face 2c. Furthermore, the hot plate unit 1 has evacuating amount adjustment valves 5a and 5b for suppressing the evacuation amount to 0.1 (liter/minute) or more and 1 (liter/minute) or lower.