Air flow devices for electronic boards

摘要

A cooling system for electronic boards and cards is described. The cooling system is designed to provide streamlined air flow about heated components disposed upon the boards. The cooling system comprises at least one deflector that utilizes naturally occurring convection within the housing to cool heated components disposed on the board. A lifter portion of each deflector causes pre-heated air from upstream components to rise above downstream components. A collector portion allows cool air to be drawn in and over these downstream components, thus keeping them cool by minimizing or eliminating the impingement of the pre-heated air. A plurality of deflectors arranged in a predetermined pattern can also be utilized.