发明名称 |
Scratch reduction in semiconductor circuit fabrication using chemical-mechanical polishing |
摘要 |
A process for polishing a layer on a semiconductor wafer in which the incidence of undesirable scratches on the polished surface is reduced by using a multiple step polishing procedure. A relatively hard polishing pad is used first to planarize the wafer surface, using a chemically reactive and abrasive slurry. A second polishing step is then carried out on a relatively soft polishing pad, using a slurry to remove or reduce scratches introduced by polishing with the hard pad. A final polishing step is performed on the soft polishing pad using de-ionized water to remove particles from the surface of the wafer.
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申请公布号 |
US5913712(A) |
申请公布日期 |
1999.06.22 |
申请号 |
US19970816390 |
申请日期 |
1997.03.12 |
申请人 |
CYPRESS SEMICONDUCTOR CORP. |
发明人 |
MOLINAR, HECTOR |
分类号 |
H01L21/304;B24B37/04;(IPC1-7):B24B7/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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