| 摘要 |
PROBLEM TO BE SOLVED: To positively grip and take out wafers even with the dispersion of the storage position of each wafer in a cassette in the case of taking out a plurality of wafers stored in the cassette, by a robot hand. SOLUTION: A wafer conveying head is provided with grip mechanism 4 having a support plate 5 fixed to a hand body 2, fixed claws 7, 7 provided on both lateral sides of a tip part of the support plate 5, a moving body provided at the lateral center of the hand body 2 and relatively movable along the advance/retreat direction of the hand body 2, and a movable claw 22 electrically supported to the moving body so as to be relatively movable in the advance/retreat direction of the hand body 2, and each wafer W is gripped between the fixed claws 7, 7 and movable claw 22. Both lateral sides of the hand body 2 are provided with keep bars 34, 34 pressing the outer peripheral edge part of the wafer W by the advance of the hand body 2 so as to move the wafer W to an inner face C1 of a cassette C until reaching a specified allowable storage position, and each wafer W is always positioned into a fixed storage position before being gripped. |
