| 摘要 |
In a sphere polishing machine, workpiece balls in a ball passageways which are formed by guide grooves 5 formed in a stationary board 2 and guide grooves 1a formed in a rotary board 1 are moved along the ball passageways while being rotated by the rotary board 1, whereby the portion of the workpiece ball which is brought into contact with the guide groove 1a of the stationary board 1 in accordance with the inclination of the axis of rotation of the workpiece ball, is polished. On each of the ball passageways, a plurality of predetermined positions are selected at predetermined intervals, and relief grooves 6a, 6b and 6c are formed in guide groove portions of the stationary board which correspond the predetermined positions so that, when each of the workpiece balls passes through each of the predetermined positions, the inclination of the axis of rotation thereof is changed.
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