CHIP COMPONENT AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a chip component wherein local bulges are prevented. SOLUTION: All of a resistive film 2, pull-out electrodes 3, and an outer package 4 are embedded within a recess 1a of a chip 1, and the resistive film 2 is located under the pull-out electrodes 3, and moreover the surface height of the extraction electrodes and the surface height of the outer package 14 match with each other and are flush with the upper surface of the chip 1, so that the outward bulge of one part of the component due to the effects of the thickness of he resistive film 2 and the outer package 4 with not occur.