发明名称 |
Use of hydrofluoric acid for effective pad conditioning |
摘要 |
A process of conditioning a polishing pad used in chemical mechanical polishing of an integrated circuit and having a glazed layer is described. The process includes introducing a conditioning reagent including at least one of hydrofluoric acid, buffered oxide etch composition and potassium hydroxide on the polishing pad to dissolve at least a portion of the glazed layer; and abrading the glazed layer and disloding at least some particles from the glazed layer.
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申请公布号 |
US5913715(A) |
申请公布日期 |
1999.06.22 |
申请号 |
US19970924493 |
申请日期 |
1997.08.27 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
KIRCHNER, ERIC J.;KALPATHY-CRAMER, JAYASHREE |
分类号 |
B24B37/04;B24B53/007;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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