| 摘要 |
PROBLEM TO BE SOLVED: To suppress the flow of a wire due to flow pressure of resins and make a package thin. SOLUTION: A semiconductor device comprises an inner lead 10, a semiconductor chip 52, and a wire 12 for electrically connecting the semiconductor chip 52 with the inner lead 10. One end of the wire 12 is connected to a surface of the semiconductor chip 52, and the other end of the wire 12 is connected to a back surface of the inner lead 10. The wire 12 can be protected from flow pressure of resins by the inner lead 10 and the semiconductor chip 52. Thus, a flow of the wire 12 due to flow pressure of resins can be restricted. Further, since the wire 12 is received as the form in between the inner lead 10 and the semiconductor chip 52, a wire height A1 can be reduced to thereby realize thinning of a package. |
