| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which is able to realize intended function in a short delivery time and has the high degree of integration. SOLUTION: A laminated chip 4 is constituted by means of bonding pads 8a, 8b,... of a first chip 8 and pads 6a, 6b,... of a second chip 6. In the first chip 8, a field programmable gate array FPGA is formed. In the second chip 6, a central processing unit CPU is formed. An LSI 2 is used as a controller for controlling, e.g. an outer device. In this case, the FPGA functions as an interface circuit for linking the CPU with the outer device. By changing the FPGA program, the intended interface circuit corresponding to the outer device can be obtained. Furthermore through the use of the laminated chip 4, this kind of controller the requirement for space saving of which is large, can be made compact. |
