| 摘要 |
PROBLEM TO BE SOLVED: To form a three-dimensional structure using a semiconductor chip by a method wherein at least one or more of projected parts are formed on the outer periphery of the chip substrate of the chip, and the projected parts are inserted in recess parts, which are individually formed dividedly in a base substrate for fixing the chip on the base substrate. SOLUTION: A light-emitting element, a light-receiving element, a mirror, a lens, a microscopic electro-mechanical structure and the like are formed on a semiconductor chip 19. Projected parts 18, consisting of a martial constituting a substrate of the chip 19, are formed on the outer periphery of the chip 19, and the number of the parts 18 can be one or a plurality. The wholes of the parts 18 are formed in a form, which is gradually tapered toward the points thereof. Thereby, the parts 18 are enabled to insert smoothly in recessed parts 21, and openings 22, which are formed in a base substrate 20 and are individually divided, are made insartable in accurate positions. Especially, at the time of the insertion of the parts 18, the parts 18 are prevented from being broken and a three-dimensional structure 23 can be formed. |
