| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package in which a container is sealed completely airtightly and which is capable of stably operating a semiconductor element. SOLUTION: A package which is used to house a semiconductor element is composed of a base body 1, in which a semiconductor-element mounting part 1a is formed in the central part on the surface, in which a frame body 2 surrounding the mounting part 1a is formed in the outer circumferential part, a through-hole 6 of which is formed to be passed through the frame part 2 and into and through which an optical fiber 8 is inserted and passed to be fixed via an adhesive 9 a lid body 3 of which is attached to and placed on, the surface of the frame part 2, and which closes the inner side of the frame part 2. Young's modulus of the adhesive 9 is set at 3 GPa or lower. Even if a large difference in a coefficient of thermal expansion exists between the optical fiber 8 and the adhesive 9 which fixed the optical fiber 8, and even if a a large thermal stress is generated between both when heat is applied, the thermal stress is adsorbed by the deformation of the adhesive 9. As a result, it is possible to effectively prevent the optical fiber 8 from being stripped from the adhesive 9 and to effectively prevent cracks from being generated in the adhesive 9. |
