发明名称 ULTRASONIC FLAW DETECTOR
摘要 PROBLEM TO BE SOLVED: To enable a defect removing device to determine grinding locations automatically by creating a result map of flaw detection in the directions of the shaft circumference and the shaft length of a specimen and the location of defect depth through the use of a two-probe technique by a signal transmitter to transmit rotational pulses, and ultrasonic probes for transmission and defect wave reception. SOLUTION: This detector is formed of an ultrasonic probe 16 for the reception of defect waves, an ultrasonic center beam path length 18 in a two-probe technique, a signal transmitter 19 to transmit pulses in the directions of a shaft circumference and a shaft length, a defect depth determining part 20, a result computing part 21, an automatic defect removing device 22, etc. At the time when a transferring device 8 transfers a specimen 1 to immediately beneath ultrasonic probes 15 and 16 for transmission and the reception of defect waves, a detecting device 9 follows an instruction for starting flaw detection from a control device 7 and starts a process for acquiring flaw detection data. A result editing part 21 waits for an instruction for completing a flaw detection process and transmits map information on the results of flaw detection to the automatic defect removing device 22. The defect removing device 22 is moved to a specific part of the specimen 1 to grid the specific part.
申请公布号 JPH11166916(A) 申请公布日期 1999.06.22
申请号 JP19970332725 申请日期 1997.12.03
申请人 MITSUBISHI ELECTRIC CORP;SANYO SPECIAL STEEL CO LTD 发明人 ISHIKAWA TAKAAKI;KOBAYASHI TOSHITAKA;KOBAYASHI HIROTO;OKUYAMA TOSHIYUKI
分类号 G01N29/04 主分类号 G01N29/04
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