发明名称 |
Multi-layer ceramic electronic part |
摘要 |
A highly reliable multi-layer ceramic electronic part in which is compact, in which cracks tend not to occur in the ceramic element even in cases where it is handled in bulk by a chip mounting device. A plurality of electrodes (internal electrodes) are disposed within a ceramic element whose length L</=1.0 mm, height H</=0.5 mm and width W</=0.5 mm. The thickness t1 of a ceramic outer layer portion of the multi-layer ceramic electronic part, is 0.15 mm or less. The thickness of the ceramic outer layer portion t1 and the thickness t2 of the portion where the internal electrodes are disposed have the relationship +E,fra 1/4+EE t2</=t1</=+E,fra 1/3+EE t2. |
申请公布号 |
SG65655(A1) |
申请公布日期 |
1999.06.22 |
申请号 |
SG19970002042 |
申请日期 |
1997.06.12 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
NOJI TAKASHI;OGAWA MAMORU |
分类号 |
H01G4/12;B32B18/00;H01G2/06;(IPC1-7):H01G4/12 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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