METHOD AND APPARATUS FOR PATTERN TRANSFER

摘要

PROBLEM TO BE SOLVED: To provide a pattern transfer method for reducing connection defects. SOLUTION: Identical patterns (connection patterns 64a and 64b) are overlapped and formed at the end parts of adjacent main field of vision 63 and 63' in a chip pattern 61 on a mask. The connection patterns are practically overlapped in identical positions in the connection parts of a wafer with comparatively low dose to expose them. The total dose of two time exposures is made to be substantially equal to the dose of a part except for the connection part. Even if a small shift difference exists between two pattern images connected on the wafer, the shift is distributed to the two images and the patterns of the connection parts continue in a state such that they are traced satisfactorily. Thus, connecting precision is improved.