发明名称 |
Method for removing spin-on-glass at wafer edge |
摘要 |
The present invention provides a method for removing unwanted coating layer at wafer edge by first immersing the wafer edge in a cleaning solution and then immersing in a rinsing solution such as deionized water to remove the residual cleaning solution from the surface of the wafer. The wafer can be dried in a subsequent spin dry process.
|
申请公布号 |
US5913979(A) |
申请公布日期 |
1999.06.22 |
申请号 |
US19970780399 |
申请日期 |
1997.01.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
SHEN, CHIH-HENG;LIN, HUI-TZU |
分类号 |
B08B3/08;H01L21/00;(IPC1-7):B08B3/08 |
主分类号 |
B08B3/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|