| 摘要 |
PURPOSE:To provide a resin composition having excellent high temperature reliability and moisture resistant reliability and used for sealing semiconductors by compounding an epoxy resin, a curing agent and a filler as essential components and further a sodium antimonate compound. CONSTITUTION:(A) 5-25wt.% of an epoxy resin, (B) 2-15wt.% of a curing agent (preferably a novolak resin) in an A:B chemical equivalent ratio of preferably 1:0.6-1.5, especially 0.8-1,3, (C) 70-90wt.% of a filler (preferably molten silica), (D) 0.02-30wt.%, preferably 0.02-10wt.%, of a sodium antimonate of the formula (X is 0.1-0.5, especially 0.4-1.0). preferably treated at a high temperature to remove water of crystallization, if necessary, a curing agent in an amount of 0.1-10wt.% per 100wt.% of the component A and further other additives are compounded with each other and melt-kneaded to provide the objective composition. |
