| 摘要 |
PROBLEM TO BE SOLVED: To stabilize quality of bonded inner leads and improve availability of a wire bonding device, by electrically connecting the inner leads to pads of a semiconductor chip through metallic thin wires when bonding positions of the inner leads are within permitted limits. SOLUTION: After a lead frame mounted with a semiconductor chip 1 is fixed on a heat stage, bonding positions of pads 1a and inner leads 2a of the lead fame are recognized and the bonding positions of inner leads 2a to the pads 1a are corrected based on the recognized results. When it is discriminated that the bonding positions of the inner leads 2a are within permitted limits due to this correction, the inner leads 2a are electrically connected to the pads 1a of the semiconductor chip 1 through metallic thin wires 3. Therefore, the occurrence of insufficient press-fitting of the tips of the bonded inner leads 2a can be reduced. |
