| 摘要 |
PROBLEM TO BE SOLVED: To achieve thin configuration of a semiconductor device. SOLUTION: This semiconductor device, in which a resin sealing body 8 is provided, two semiconductor chips 1A and 1B which are located inside of the resin encapsulating body 8 and an outer terminal is formed on the upper surface among the upper and back surfaces, are provided, leads 2, 3 and 4 extending along at the inner and outer sides of the resin encapsulating body 8 are provided, the leads 2, 3 and 4 are branched into two parts at least inside of the resin encapsulating body 8, one branched lead 3A is fixed to the surface of one semiconductor chip 1A and electrically connected to the outer terminal of the surface, and the other branched lead 4A is fixed to the surface of the other semiconductor chip 1B and electrically connected to the outer terminal of the surface. The respective chips of two semiconductor chips 1A and 1B are laminated in a state in which the respective backsides are made to face each other. |
