| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin non-contact card medium equipped with an antenna circuit, and a method for manufacturing this card in which the number of parts is reduced, and a manufacturing process is simplified. SOLUTION: A semiconductor integrated circuit chip 8 incorporated in a non-contact card medium 1 is provided with connecting terminals 10a and 10b as an outside electrode on a flat plane 8a, and is buried in a card substrate 2 so that a flat face 8a and the connecting terminals 10a and 10b are exposed, wherein the flat face 8a is connected with an exposed face 6 of the card substrate 2 without any difference in level. Moreover, an antenna circuit 12 constituted of a conductive layer (conductive ink or a conductive foil) 13 is arranged on the flat face 8a and the exposed face 6 of the card substrate 2 so as to be directly connected with the both faces 8a and 6, and one part of the antenna circuit 12 is arranged on the connecting terminals 10a and 10b so as to be directly connected with them so that electric connection can be attained. |
