发明名称 ELECTRIC CONNECTION APPARATUS, MANUFACTURE OF CONTACT, AND SEMICONDUCTOR TESTING METHOD
摘要 PROBLEM TO BE SOLVED: To have good stable current transmission characteristics by providing a coil-shaped spring and a conductive member, electrically connecting first and second electrodes via a conductive member, and generating a contact pressure for the first and second electrodes. SOLUTION: A contact 10 consists of an easily deformable conductive member 11 and a coil-shaped spring 12; the conductive member 11 is a member for transmitting a current consisting of, for example, a metallic wire or the like; and a contact pressure is provided by a metal ball 11a of both ends thereof contracting when the ball comes into contact with an external electrode such as semiconductor device. That is, when one end of the conductive member 11 comes into contact with a first electrode, and the other end comes into contact with a second electrode, the first and second electrodes are electrically connected via the conductive member 11, and a contact pressure against the first and second electrodes is generated by contraction of a spring 12. Thereby, a current transmission path is shortened, and stable electric transmission characteristics such as low resistance and low inductance can be provided.
申请公布号 JPH11162270(A) 申请公布日期 1999.06.18
申请号 JP19970329106 申请日期 1997.11.28
申请人 FUJITSU LTD 发明人 HASEYAMA MAKOTO;TATEISHI MASARU
分类号 G01R31/26;G01R1/04;G01R1/067;H01B13/00;H01L21/66;H01R11/18;H01R13/24;H01R33/76;(IPC1-7):H01B13/00 主分类号 G01R31/26
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