| 摘要 |
PROBLEM TO BE SOLVED: To reduce the heat capacity of a part to be soldered so as to facilitate temperature raising, improve its solderability and reduce working hours by forming a slit in a soldering terminal part of a molded wiring board. SOLUTION: A terminal slit part 1a is formed longitudinally at the center of a tab terminal 1 of a molded resin part 2 of a wiring board. By virtue of this structure, the heat capacity of the tab terminal 1 for itself is reduced and the heat transfer to a frame joined to the tab terminal 1 is suppressed, so that its solder wettability in soldering is improved and the soldering workability can also be improved. In addition, the solder is filled in the terminal slit part 1a and a crisscross solder fillet is formed, so that the soldering strength can be improved without reducing a conductive part. Still additionally, the rigidity of the tab terminal 1 is reduced by virtue of the terminal slit part 1a, and thereby, the tab terminal 1 can be inserted as if it is lured into a printed circuit board while being deformed in response to the displacement in the insertion into the printed circuit board, so that the insertion workability can be improved. |
