CERAMIC MULTILAYERED COAXIAL SIGNAL WIRING BOARD, MANUFACTURE THEREOF, AND ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain the same wiring density and wiring fineness as those on the conventional green sheet type ceramic multilayered wiring boards by forming a conductive layer with coaxial signal wirings and insulator layer on a green sheet through the screen printing method. SOLUTION: This method comprises forming through-holes 2 in a green sheet 1, forming a conductive layer 3 on the peripheries of the through-holes 2 and signal wiring-forming regions on the green sheet 1 surface by the normal screen printing method using a conductive paste, coating an insulator paste on the conductive layer 3 formed on the walls of the through-holes 2 for forming an intermediate layer 4 corresponding to an intermediate, filling a conductive paste in the through-holes coated with the conductive layer 3 to be an outside skin and insulation layer 4 to be an intermediate to form a conductive layer 3 to be a skin surrounding conductors and intermediate insulator by the screen printing method, and laminating, pressing and sintering the green sheets with coaxial signal wirings to form a ceramic multilayered coaxial wiring board with the process similar thereto.