| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can increase the durability of a cutting equipment and increase yield by fixing a wafer firmly on a base, so that cut pieces of the wafer do not peeled off from the base. SOLUTION: When a wafer member 42 is attached to an adhesive tape by the entire rear face and thereby fixed on a stage 54, an exposed part of a rear face 39 of a semiconductor wafer 33 and an oxide film 28a left over on a part other than the exposed part of the wafer are attached to the adhesive tape 52. The wafer member 42 is cut, being fixed on the stage 54 and immersed in running water. The semiconductor wafer 33 has wafer repellency so that the rear face 39 hardly peels off from the adhesive tape 52. Consequently, there is no possibility that pieces 72a are peeled off from the adhesive tape 52 scattered from the adhesive tape to damage the blade when the wafer member 42 is cut, and thereby the durability of the cutting equipment can be increased.</p> |
