| 摘要 |
<p>PROBLEM TO BE SOLVED: To readily obtain a substrate at low cost and to readily manufacture a semiconductor device and at low cost in the semiconductor device, wherein a semiconductor chip is contained in the recess of a substrate. SOLUTION: Two wiring boards 1 and 2, whose manufacture is easy are used, such that a substrate having a concave part is constituted. Furthermore, the resin encapsulation of the connections between two wiring boards 1 and 2 and the resin encapsulation of a semiconductor chip 5 can be performed at the same time in a single process by providing a gap 4 between two substrates. Thus, the substrate can be readily obtained at low cost, and the semiconductor device can be manufactured at low cost.</p> |
