| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily perform transfer to an adhesive sheet for chip shipping, by sticking a semiconductor chip on the UV curing adhesive sheet, curing the adhesive sheet by irradiating the sheet with UV rays and etching side planes of the adhered semiconductor chip. SOLUTION: In an adhering process, a UV curing adhesive sheet (acrylic adhesive) 2 is adhered on an annular frame 1 for etching, and a semiconductor chip 3 is transferred. Then, UV rays are applied to cure the adhesive applied on the adhesive sheet. Then, etching is performed, the semiconductor chip is transferred to a general weak adhesive sheet 4 and the direction of the semiconductor chip 5 is reversed, thereby improving acid resistance. The number of transfers after etching is reduced and the workability is improved. Furthermore, misarrangement of the semiconductor chips in the transfer is eliminated and the yield is improved.</p> |
