| 摘要 |
PROBLEM TO BE SOLVED: To suppress stress being generated at the time of fixing a cooling fin by making a circumferential groove in the side face of a cylindrical spacer fixed vertically to two end parts of a metallic board mounting an electronic circuit on the surface thereof and applying a plastic case having a claw part at the corresponding position. SOLUTION: An electronic circuit 4 is mounted on the upper surface of a metallic board 1 comprising a thick metallic layer 11, a thin insulating layer 12 and a conductor film and cylindrical spacers 2 are fixed vertically to the opposite ends of the board 1. A circular groove 24 is then made in the side face of the spacer 2 and applied with a plastic case 3 having a claw part 34 at the corresponding position thereof. The metallic board 1 is fixed with a cooling fin 5. Height of the plastic case 3 is set slightly lower than that of the spacer 2 and and the claw part 34 facing on the inside is stopped at the groove 24 in the spacer 24 while circumscribing and the step edge part 35 of the case 3 is fitted over the edge part 15 of the board 1. The case 3 itself spreads slightly in the±x direction through resiliency to absorb tolerance thus avoiding stress.
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