MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME

摘要

PROBLEM TO BE SOLVED: To enhance rigidity and reliability while sustaining durability by cladding a core insulating layer with outer insulating layers of different composition and material. SOLUTION: A wiring layer 16 connected through an inner via hole 18 is provided, on one or both sides thereof, with a core insulating layer 13 at an aramid reinforced epoxy based resin having high filling factor and formed on the core insulating layer 13. An outer insulating layer 17 connected through an inner via hole 18 with the wiring layer 16 serves as a multilayer wiring board of an aramid reinforced epoxy based resin having low filling factor and the rigidity of the core insulating layer 13 is set higher than that of an outer insulating layer 11. Content of aramid fiber is preferably set at 70 wt.% and 50 wt.%, respectively, for the aramid reinforced epoxy based resin having high and low filling factor. The layers 13, 17 are hot pressed after being laminated to produce a muitilayer wiring board 10.