发明名称 FORMING METHOD OF THICK FILM RESISTOR
摘要 PROBLEM TO BE SOLVED: To increase resistance value precision and reduce current noise, by performing thermal treatment at a specified peak temperature, after resistance paste is printed and baked, and a resistance value is corrected to be a desired value by laser trimming. SOLUTION: A forming method of a thick film resistor uses difference of a temperature where current noise is reduced and a temperature where change of resistance value is increased. The difference is caused by thermal treatment of the thick film resistor after laser trimming. That is, after the resistance value of the thick film resistor is corrected by laser trimming, thermal treatment is performed in the range of peak temperature 300-550 deg.C, so that current noise increased by the laser trimming is reduced again, scarcely changing the resistance value corrected by the laser trimming. When glass paste is printed and baked on the thick film resistor before the laser trimming, the change of resistance value can be more reduced by thermal treatment in the above temperature range.
申请公布号 JPH11162717(A) 申请公布日期 1999.06.18
申请号 JP19970339386 申请日期 1997.11.25
申请人 SUMITOMO METAL MINING CO LTD 发明人 MAKUTA FUJIO;KAWAKUBO KATSUHIRO
分类号 C04B35/64;H01C17/00;H01C17/242 主分类号 C04B35/64
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