| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is provided with an insulating base, in which a positioning mark which serves as a reference when a semiconductor device is mounted can be accurately formed, and an electrode of a semiconductor device and a via conductor provided to a mount are accurately aligned with each other and electrically connected together. SOLUTION: A wiring board consists of an insulating base 1 and a wiring conductor 3 formed inside and/or on the surface of the base 1, wherein a mounting region where a semiconductor device 6 provided with electrodes on its underside is mounted, a via conductor 2 formed inside the mounting region and connected to the electrodes of the semiconductor device 6 through the intermediary of bump conductors 7 and the wiring conductor 3, and a via hole 5 formed adjacent to the mounting region are provided to the upside of the insulting base 1. The via hole 5 is formed with positional accuracy kept high and serves as an aligning mark to the via conductor 2, so that the semiconductor device 6 can be mounted accurately at a prescribed position, and the electrodes of the semiconductor device 6 and the via conductors 2 can be connected together accurately.
|
