| 摘要 |
PROBLEM TO BE SOLVED: To improve the luminance of a light emitting element in the case of viewing from the upper part, to miniaturize an LED and to realize high- definition display by providing all the electrodes of the light emitting element on a surface coming in contact with a circuit board. SOLUTION: The circuit board 7 where a recessed part for mounting the light emitting element 1 is formed is produced. A solder part 10 is formed on a rear-surface electrode 9 by a plating method. A light reflector 11 is stuck to the inner wall of the recessed part of the board 7 near the side surface of the element 1. A projection 4 is formed on the electrode 2 of the element 1 by a wire bonding method. The element 1 where the projection 4 is formed is immersed in a thinly spread conductive adhesive so as to transfer the adhesive 5 to the projection 4. After the element 1 where the adhesive 5 is transferred to the projection 4 is aligned with the board 7, it is mounted at the specified position. Then, the adhesive 5 is hardened so as to conduct between the board 7 and the element 1. |
