| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting board which can maintain a stable connection of a semiconductor element to the surface of a wiring board of high thermal expansion firmly over a long period against application of a heat cycle due to actuation/stop. SOLUTION: In a semiconductor element mounting board formed by adhering and fixing a semiconductor element having a connection electrode by a thermosetting resin onto the surface of a wiring board, by applying a metallized wiring layer on the surface of an insulating board having a coefficient of thermal expansion of 8-25 ppm/ deg.C and a Young's modules of 200 GPa or less at 40-400 deg.C, and then connecting the metallized wiring layer with the connection electrode by a conductive connection member, a resin having a coefficient of thermal expansion of 10-40 ppm/ deg.C at -40 to -25 deg.C and a Young's modules of 5-10 GPa within the same temperature range is used as the thermosetting resin for fixation. |
