| 摘要 |
<p>PROBLEM TO BE SOLVED: To hold a wafer with a uniform pressure as well as to make it into a simple structure by integrally forming such that plural tab parts are placed on an inner end surface of a holding plate. SOLUTION: A holding device 10 is constituted of a wafer holding ring 11, an annular wafer holding plate 12, plural coil springs 13, and a plate spring 14. The wafer holding plate 12 is such that its inner diameter is equal to or slightly smaller than that of a wafer S, and its outer diameter is equal to the wafer holding 11, and a projected tab part 121 that can hold a peripheral part of the wafer S in plural, e.g., twelve positions, are formed in a body on a main ring 122 at regular angle intervals on its inner end surface. So even if heat which is applied to the wafer is dissipated from the tab parts to the holding plate, because all tab parts are connected with via the holding plate, the overall wafers are kept at a uniform temperature, and still more, the wafer can be held with a uniform pressing force.</p> |
