发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To facilitate fuse blow in a fuse circuit of a semiconductor device. SOLUTION: One surplus wiring constituting a fuse circuit consists of a fuse 12 blown by a laser beams, a conductor wiring 13a extended from one side to the part beneath the fuse 12 and another conductor wiring 13b extended from the other side as well contacts 14a, 14b electrically connecting respective both ends beneath the fuse 12 to the the ends of the conductor wrings 13a, 13b. In such a constitution, the length of the fuse is set up to exceed the interval between the ends of the conductor wirings 13a, 13b but not to exceed the photoirradiation beam diameter.
申请公布号 JPH11163147(A) 申请公布日期 1999.06.18
申请号 JP19970326584 申请日期 1997.11.27
申请人 TOSHIBA CORP 发明人 OHASHI HAJIME
分类号 H01L27/04;H01L21/82;H01L21/822;H01L23/525;H01L23/528;H01L27/108;(IPC1-7):H01L21/82 主分类号 H01L27/04
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