LEAD FRAME AND RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME,申请号JP19970326687-传众专利搜索

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发明名称	LEAD FRAME AND RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME
摘要
申请公布号	JPH11163023(A)	申请公布日期	1999.06.18
申请号	JP19970326687	申请日期	1997.11.27
申请人	NEC KYUSHU LTD	发明人	MORI NOBUYUKI
分类号	H01L21/60;H01L23/50;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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